Fuse Blade Contact For Cylindrical Semiconductor
Model Number:ASWT-F103-2
Material:T2
Application:EV/PV/NH Fuse link
MOQ:1000pcs
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Product Introduction
In DC power electronic systems, the performance of fuse contacts directly determines the response speed of circuit protection and the system safety level. This Fuse Blade Contact For Cylindrical Semiconductor is specifically designed for cylindrical semiconductor fuses, manufactured with high-purity copper, and suitable for DC voltage applications. It enables rapid melting and stable conductivity under harsh operating conditions. This product can also be used as a Fuse Contact Blade in various power semiconductor protection solutions, playing a crucial role in new energy, electric vehicles, energy storage systems, and industrial power supplies.
Core Material and Structural Advantages
Highly Conductive Copper Substrate
Utilizing a high-purity Metal Copper Blade structure, it boasts excellent conductivity and low energy loss characteristics.
Optional Copper/Brass Alloy Solutions
Brass/Copper Contact solutions are available to balance strength and conductivity, depending on application requirements.
Compatible with Cylindrical Fuse Structure
The Cylindrical Body Contact Knife, specifically designed for semiconductor fuses, ensures high compatibility with the fusible element and end cap.
Stable Blade-Type Structure
The compact blade structure and large contact area, combined with the Copper Knife design, help reduce temperature rise and improve current-carrying capacity.
Typical Application Areas
Semiconductor Protection Fuses
DC Power Supply Systems
New Energy and Energy Storage Systems
High-Voltage Electrical Protection for Electric Vehicles
Industrial Inverters and Rectifiers
In new energy applications, this product can also serve as an EV Fuse Copper Contact, providing reliable protection for high-value power devices.
Storage and Packaging Instructions
To ensure the product remains in optimal condition before delivery and use, Fuse Blade Contact is packaged in standardized packaging upon shipment. Recommended storage conditions are as follows:
Shelf Life: No more than 1 year from the date indicated on the packaging label
Ambient Temperature: -15°C to +30°C (non-condensing)
Relative Humidity: ≤ 85% RH
Environmental Requirements:
Avoid exposure to corrosive gases or sea breezes
Free from significant dust
Avoid direct sunlight
Do not apply external loads that may cause deformation or performance degradation
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