Laminated BusBar

 

Laminated copper busbars require exceptional raw material purity and cold-forming execution to achieve optimal electrical throughput. We source high-grade C1100 (ETP) and C1020 (OFHC) copper strip foils with a minimum of 100% IACS electrical conductivity.

 

Our automated multi-station progressive stamping tools process copper foil thicknesses from 0.05mm to 0.5mm, ensuring smooth sheared edges free of burrs (> 0.02 mm burr height strictly rejected) to prevent micro-punctures in inter-layer insulation films.

 

Precision tooling manufactured on WAIDA PG profile grinders guarantees stamping tolerances within ±0.01mm. Stacking and multi-layer alignment are conducted under vision-guided position fixtures, maintaining mechanical stability prior to molecular joining.

 

Parameter / Specification	Standard Value / Technical Metric	Testing / Compliance Standard
Base Material Grade	C1100 T2 Pure Copper / C1020 OFHC Copper	ASTM B152 / GB/T 2040
Foil Thickness Range	0.05mm – 0.5mm (Custom Stacking)	ISO 2286-3
Electrical Conductivity	≥ 100% IACS (58.0 MS/m)	IEC 60028 / ASTMB193
Dimensional Tolerance	Pitch/Hole Center: ±0.01mm; Length: ±0.05mm	CMM / Nikon Optical Comparator
Stray Inductance	< 10 nH (Low-Inductance Design)	High-Frequency LCR Meter Test
Dielectric Strength	> 15 kV/mm (PET/Kapton/Nomex Insulation)	IEC 60243-1
Flammability Rating	UL 94 V-0	Self-Extinguishing UL 94 Flame Test

 

 

To achieve zero-resistance physical joints, Apollo utilizes advanced molecular diffusion bonding (molecular welding). Under elevated temperature and mechanical pressure, copper atoms cross foil interfaces without solder flux, creating a solid metallurgically bonded contact block. This process eliminates intermetallic voids, micro-cavities, and thermal bottlenecks inherent in conventional brazing. For hybrid connection demands, our fiber laser welding and resistance silver-tin soldering cells provide smooth, crack-free joints with zero spatter.

 

Insulation systems are applied using automated heat-shrink tubing, high-temp Kapton/Nomex film wrapping, or electrostatic epoxy powder coating. All insulated busbars undergo 100% dielectric breakdown testing (>15kV/mm) and dynamic temperature cycling (-40°C to +150°C). Plating options include high-density matte/bright tin (3–8µm) or electroplated silver (3–10µm) over nickel undercoats, tested via X-ray fluorescence (XRF) to resist fretting corrosion and contact oxidation over extended operational cycles.

 

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Quality assurance at Apollo follows strict automotive-grade frameworks under IATF 16949:2016 and ISO 9001:2015 management systems.

 

Dimensional verification is executed on Zeiss and Hexagon 3D Coordinate Measuring Machines (CMM) with volumetric precision up to 0.0007mm, supplemented by optical profile projectors for rapid multi-hole center checks.

 

Every production lot undergoes rigorous electrical and mechanical verification:

Thermal Rise & Current Loading: Continuous full-load temperature rise testing up to 2000A.

Dielectric & Withstand Voltage: 100% power-frequency high-voltage insulation testing.

Micro-Resistance Verification: Micro-ohm meter inspection across welded contact terminals (R < 5 µΩ).

Peel & Shear Strength: Mechanical pull testing to ensure no delamination under continuous 3G vibration profiles.

 

We provide full PPAP Level 3 submission packages including Control Plans, Process Failure Mode and Effects Analysis (PFMEA), Capability Analysis (CPK > 1.67), and raw material mill certificates.

 

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Eliminate thermal bottlenecks, lower stray inductance, and secure stable direct-factory supply for your next-generation power electronics. Submit your 2D engineering drawings (.DWG, .PDF) and 3D CAD files (.STEP, .IGES) today. Our senior metallurgical and stamping application engineers will deliver a comprehensive DFM manufacturability analysis, thermal loading review, and transparent factory-direct quotation within 24 hours.

 

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