Metallized Film Capacitor Bus Bar

Material Standard

GB : T2 Copper with Min. 99.9%
DIN: E-Cu58 (Number: 2.0065)
EN: Cu-ETP ( Number: CW004A)
ISO: Cu-ETP
UNS: C11000
JIS: C1100
BS: C101
Other Material also can be customized

Resistance

0.00001Ω

Copper Tensile Strength

≥500N

Copper Thickness

1/2/3/5/10mm,depend on bus bar structure

Surface Plating

Nickel, tin or silver plated etc
Plating Thickness:Normally 3um to 12um

Salt Spray Testing

In a neutral environment, nickel can bear 24 hours. Silver is lower, tin is lowest

Bending Testing

Bend 10000 times in 15 radian angle without breakage or fracture.

Temperature Rise Testing

Depend on busbar cross-sectional area

Operating Temperature

-45 to +150 ºC

Mechanical properties

■Rigid prefabricated structures with custom shapes and shapes.

■Efficient use of cabinet space and PCB surface.

■Use less space than a harness.

■Integrate components related to power distribution.

■Fast, error-free and cost effective installation.

■Convenient and quick maintenance.

■Fully insulated.

■Modular.

Electrical properties

■ High voltage - up to 4kV

■Multiple voltage

■Pollution-free power distribution: high capacitance, low inductance

■High voltage distribution, low voltage drop

■Partial discharge test is supported

1

Processing Technologys and Equipments

1.Stamping;

2.Machining;

3.Riveting;

4.Welding;

5.Laser Cutting;

6.CNC Punching;

7.Bending;

8.Electroplating,etc equipments.

2

Various Welding Processes

1.High temperature tunnel soldering(tin-welding);

2.Resistance Tin/Silver Brazing;

3.Laser welding;

4.Argon arc welding;

5.Tig welding,etc.

3

Various Surface Treatments

1.Tin-plated;

2.Nickel plated;

3.Silver plated;

4.Copper plated;

5.Ultrasonic cleaned and passivation,etc.

4

Professional In

New energy Capacitors’ Busbar and Fuses Stamping and Welding solutions with Copper/Brass/Aluminum/Steel materials.