Deciphering the internal structure of Laminated BusBars for Power Capacitor DC Link to enable efficient operation of power electronic equipment

In the process of upgrading the power electronics industry towards higher efficiency and miniaturization, the Laminated BusBars for Power Capacitor DC Link, as a core component connecting capacitors and power modules (IGBT/SiC), is widely used in equipment such as frequency converters, new energy vehicle inverters, and high-power power supplies due to its unique structural design. It is known as the "highway" of the power distribution system. The scientific nature of its internal structure directly determines the operating efficiency and stability of power electronic equipment, making it a core focus of industry attention.

The core of the internal structure design of the laminated busbar for power capacitors lies in multi-layer composite and high-density integration. Through the precise stacking and hot-pressing of conductive layers, insulating layers and adhesive layers, an integrated structure with conductive, insulating and mechanical support functions is formed. The core consists of three parts: conductive layer, insulating layer and adhesive layer. The working together of each layer ensures the stability and safety of power transmission.

The conductive layer, as the core carrier of current transmission, is mostly made of thin copper or aluminum foil and is divided into positive and negative plates, which undertake the functions of current input and output. The insulating layer is sandwiched between the conductive layers and uses high-performance insulating materials such as polyimide and polyester to prevent short circuits between the positive and negative electrodes. The adhesive layer is used to firmly bond the conductive layer and the insulating layer, ensuring the rigidity of the overall structure, improving the seismic performance, and adapting to complex working conditions for BusBar for Electric Welding Machine.

To meet the stringent requirements of power electronic equipment for low parasitic inductance, the laminated busbar adopts a stacked, tightly interlaced structure design. This ensures that the positive and negative plates are arranged parallel and closely, utilizing the principle of mutual cancellation of current and magnetic fields to significantly reduce stray inductance. This design is suitable for high-speed switching IGBT devices and prevents voltage spikes from damaging the equipment. Simultaneously, precise openings are provided internally for interfacing with capacitor pins, ensuring minimal connection resistance and improving transmission efficiency.

The multi-layer composite structure gives laminated busbars three core advantages: extremely low parasitic inductance to suppress voltage spikes and protect power modules; highly compact design to save internal space and optimize power distribution system layout; and excellent current carrying capacity while reducing current transmission loss, making it suitable for the high power requirements of the power electronics field and for the installation and operation of various power electronic devices.

Industry insiders say that as power electronic devices develop towards higher power and higher frequency, the requirements for the structural precision, insulation performance, and current carrying capacity of laminated bars will be further increased. In the future, by optimizing material selection and structural design, such as adapting to specific scenarios like Laminated BusBars for Power Capacitor DC Link, laminated bars will continue to empower new energy, industrial automation, and other fields, promoting the high-quality development of the power electronics industry.

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